Effects of NH3, O2, and N2 co-implantation on Cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene

Авторы
Zhang W. 4, 2, 1 , Ji J. 1 , Yan Q. 1 , Zhao J. 2 , Chu P.K. 2 , Zhang Y. 3 , Kurmaev E.Z. 5 , Moewes A. 6
Journal
Прикладная наука о поверхности (Applied Surface Science)
Издательство
Elsevier
Номер выпуска
22
Язык
English
Страницы
8981-8985
Статус
Published
Том
253
Год
2007
Организации
  • 1 Technical Institute of Physics and Chemistry|Chinese Academy of Sciences
  • 2 Department of Physics and Materials Science|City University of Hong Kong
  • 3 Graduate School|the Chinese Academy of Sciences
  • 4 School of Materials Science and Technology|China University of Geosciences
  • 5 Institute of Metal Physics|Russian Academy|Sciences-Ural Division
  • 6 Department of Physics and Engineering Physics|University of Saskatchewan
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