Electrochemical behavior and cytotoxicity evaluation of the Ti-Fe-Cu-Sn alloy

This work investigates the Ti-Fe-Cu-Sn titanium alloy as a potential replacement for widely used alloys in human musculoskeletal implants. The relevance of this study is driven by the need for new implant alloys with mechanical characteristics comparable to those of commonly used materials, but with less toxic and non-allergenic components. It has been established that the candidate alloy Ti94Fe1Cu1Sn4, with high mechanical properties, exhibits enhanced biocompatibility. In addition, the passive film formed on it has excellent protective ability. This was confirmed by the lower corrosion current density at Ecorr and in the passive state along its entire length, which is attributed to the incorporation of Sn, Cu, and Fe compounds into its composition. Furthermore, cytotoxicity studies showed high cell survival rates, and the absence of toxic components significantly reduces the risk of allergic reactions. © 2025 Elsevier B.V., All rights reserved.

Авторы
Bautin Vasily A. 1 , Zadorozhnyy Vladislav Yu 1, 2 , Moskovskikh Dmitry O. 1 , Korol Artem A. 1 , Abakumov M.A. 1 , Savilov Serguei V. 3 , Vadekhina Veronika V. 4 , Shushania Batal A. 5 , Sarac Baran 6 , Korsunsky Alexander M. 7
Издательство
Elsevier B.V.
Язык
English
Статус
Published
Номер
101129
Том
9
Год
2025
Организации
  • 1 National University of Science & Technology (MISIS), Moscow, Russian Federation
  • 2 RUDN University, Moscow, Russian Federation
  • 3 Lomonosov Moscow State University, Moscow, Russian Federation
  • 4 Department of Medical Biotechnologies, Pirogov Russian National Research Medical University (RNRMU), Moscow, Russian Federation
  • 5 National Medical Research Center for High Medical Technologies — Vishnevsky Central Military Clinical Hospital, Krasnogorsk, Russian Federation
  • 6 Institute of Casting Research, Montanuniversitat Leoben, Leoben, Austria
  • 7 Skolkovo Institute of Science and Technology, Moscow, Russian Federation
Ключевые слова
Bacterial inhibitory property; Cytocompatibility; Hypoallergenic; Passive film; Ti-Fe-Cu-Sn
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